System Design
- Performance and Cost tradeoff analysis
- "Feeds and speeds" feasibility analysis
- Digital Signal Processing Architecture
- Creation of high-level design documents
Embedded Systems
- Microcontrollers: 8052, Cypress, Cygnal, 68HCxx, 80188, PIC, Z80, Dragonball, H8, X86
- Firmware development
- Real-time multitasking operating environments
- Control applications
- Sensor applications
Software Development
- Real-time, multitasking
- Embedded applications
- Windows, Linux, QNX
- Device drivers
- Application software
- Communications applications
Digital Hardware Design
- ASIC and FPGA development (Verilog or VHDL)
- High speed logic
- Hardware DSP implementation
- Battery-operated, ultra low power
- Embedded processors
- Imaging and graphics systems
Analog Hardware Design
- Sensor design: magnetic, capacitive, ultrasound, optical, acoustic, inertial, RF, strain, pressure, radar
- Instrumentation
- Battery-operated, ultra low power
- Video signal processing
- Power electronics
- Lithium-Ion battery charging and safety circuits
Graphics
- Graphics display ASIC design
- Video genlock circuits
- Video scan conversion
- CCD and CMOS imaging sensors application
- Image processing
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Communications
- Wireless system design link equation evaluation, traffic simulations
- RF circuit design
- Adaptive equalizers
- Spread spectrum systems
- Modems
- Telephony
- 10 and 1 Gigabit ethernet
- USB
- Bluetooth
- Mobile wireless channel simulation
- Satellite links
- Fiber optic
- Broadcast video
- Acoustics
- Hearing aids
Motion Control
- Servo motor drive circuits
- Control loops
- High resolution position feedback
- Stepper motor control
Mobile Platforms
- Avionics helicopter and fixed wing
- Automotive electronics
- Human body
Printed Circuit Board Design and Prototyping
- High-speed signal integrity matched length and differential pair routing, controlled impedance
- Gigabit signal integrity
- Analog, digital, and RF mixed signal
- Design for low-cost, high-yield, manufacturing
- EMI minimization
- Power circuits
- Latest package technologies, including BGA, TSOP, SSOP
- Flex circuits
- Protel, Cadence, PADS, Orcad
- Quick turn prototype purchasing, fabrication, assembly, and bring-up
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